Features  

·Throughput: 600pcs/batch,14400pcs/h(210mm wafer)；720pcs/batch,17280pcs/h(182mm wafer); 

·Process bath circulation volume adjustable;

·Uniform pyramids texture,etch depth adjustable;

·Wafer thickness down to 120um;

·With clean dry area and self-clean dry system;

·Low H₂O₂ consumption;

·Quick inline bath change;

·Available with MES,RFID system,inline weight testing optional.