Features  

·Throughput: 600pcs/batch,14400pcs/h(210mm wafer)；720pcs/batch,17280pcs/h(182mm wafer); 

·Compatible with rear side etch polishing and mono-crystalline rear side texturing process;

·Suitable for various additives;

·Wafer thickness down to 120μm;

·With dry clean area and self-cleaning system;

·Quick inline bath change;

·Suitable with MES,RFID system, inline weight testing optional.